LiM-X150A Series

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LiM-X150A Series
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Technical Parameters

Build Envelope

φ140mm×180mm;φ100mm×100mm;φ80mm×100mm.Incl. 20mm Substrate

Variable Layer Thickness

20 ~ 100μm

Laser Power

IPG 200W ;500W

Scanner

Scanlab High-speed Scanner

Field Lens

Sill f-θ Lens

Recoater

Variable Speed Powder Recoater<One-way>

Laser Beam Quality

M2≤ 1.1

Scanning Speed

≥7 m/s

Build Rate

≥15cm3 /h 200W Laser;≥30cm3 /h 500W Laser

Power Dissipation

≤ 5kW

Available Material

Superalloy, Aluminum Alloy, Titanium Alloy, Stainless Steel, Die Steel, Tungsten Alloy, Cobalt Chromium Alloy, Etc

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Equipment Advantages


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500 ℃ High Temperature Preheating

To achieve the overall cylinder heating.

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Multiple Forming Sizes

Nested forming cylinder, more saving powder.

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Wider Application Scenarios

Input voltage of 220V.

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High Precision Forming Platform

The positioning accuracy can be controlled within ± 0.005mm.

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Self-developed Software

LiMPCS-SLM software ensures the normal operation of the equipment.

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Safe and Reliable

ISO standard, CE safety, CE explosion proof certification.

Related Cases


Continuous research ushered in a new breakthrough, radium laser to achieve pure tungsten material printing!


As we all know, the melting point of pure tungsten (W) is as high as 3410 degrees Celsius, which is a refractory metal. It is very difficult to print pure tungsten materials for selective laser melting equipment. Recently, the process development team of Beijing Technology Center (Xin Jinghe Laser Technology Development (Beijing) Co., Ltd.) has conquered the printing process of pure tungsten materials and realized stable production on radium laser LiM-X150A equipment.

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